wafer bonding

基本解释

Through the silicon bonding, we achieve a wafer-level vacuum package, and the wire-bonding PAD is made after the fabrication is complete.
在完成整体结构圆片级真空封装的同时，通过引线腔结构方便地实现了中间电极的引线。
A silicon wafer bonding technology and its application to new dielectric isolation combined with conventional V-shaped grooves are described.
本文介绍了将我们开发的硅片粘合技术与传统V形槽隔离工艺相结合而研制成功的一种新的介质隔离方法。
Without any kind of glue, wafer bonding technology is able to integrate two polished semiconductor wafers and thus be used widely in fields like micro-electronics micro-mechanics and optoelectronics.
晶圆键合可以使得经过抛光的半导体晶圆在不使用粘结剂的情况下结合在一起。