ulsi

基本解释

This paper describes the development of phase shifting lithography and its applications in ULSI technology.
本文综述了相移光刻技术的发展及其在ULSI中的应用。
Dishing problem of copper multilayer interconnection in ULSI was introduced, and the reasons and influencing factors were analyzed.
介绍了ULSI多层铜互连线中的碟形坑问题，对其产生的原因及影响因素进行了分析。
In this thesis, we focuse on the microstructure and stress of ULSI Cu interconnects with their impacts on MTF of the electromigration.
本论文主要研究了ULSI中铜互连线的微观结构和应力及其对与电徙动MTF的影响。