electronic packaging

基本解释

Electronic packaging design;
电子封装设计；
With the change of material and technics in electronic packaging, it brings the problem of solder joint reliability.
电子封装高度集成化，使得焊点可靠性评估更加困难，而封装无铅化，又给焊点可靠性研究带来新的问题。
ANSYS Q3D Extractor software is the premier 3-D and 2-D parasitic extraction tool for engineers designing electronic packaging and power electronic equipment.
ANSYS Q3D提取软件是首屈一指的3-D和2-D寄生提取工具，电子封装和电力电子设备设计的工程师。

They are working toward goal of 100% electronic distribution of software with no packaging or shipping of products.
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Crump studied mechanical engineering at Washington State University before starting his own company, an oddball maker of automated packaging machinery and large electronic scales.
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The GreenHeart label means reduced packaging, recycled plastics, waterborne paints, and an electronic in-phone manual instead of a paper booklet.
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电子封装
The results show that SiCp/Cu alloy electronic packaging shell with high content and uniformly distributed SiC particle can be produced at 910℃ and punching velocity of 100 mm/s, meeting the requirements of electronic packaging shell.
模拟结果表明,在半固态温度为910℃、挤压杆速度为100mm/s时,可以得到SiCp含量较高且分布较均匀的SiCp/Cu合金电子封装壳体,且能满足电子封装壳体的要求。
电子、通信与自动控制技术
电子封装
The rapid development of the high-density solder interconnection in the electronic packaging industry brings about the continiuous decrease in the size and stand-off height (SOH) of solder joints.
电子封装微互连正向高密度化方向快速发展,微焊点的尺寸及互连高度在不断降低。
电子组装
电子構装
电子构装