Leadframe

基本解释

This small footprint package is lead (Pb) free, with 100% matte tin leadframe plating.
该小型封装为无铅产品,且引脚框采用100%25雾锡电镀。
The leadframe is plated with 100% matte tin, which is compatible with standard lead (Pb) free printed circuit board assembly processes.
引脚架采用100%25雾锡电镀,可与标准无铅印刷电路板装配流程兼容。
Effects of thermo-mechanical treatment(TMT) on microstructure and properties of C194 copper alloy leadframe materials were investigated.
研究了形变热处理对C194铜合金引线框架材料组织和性能的影响。
It is available in a lead (Pb) free (leadframe plating 100% matte tin) 6-pin MLP microleadframe package for surface mount, with exposed pad for enhanced thermal dissipation.
该器件采用供表面安装的无铅(引脚框是100%25雾锡电镀)6引脚MLP微型引脚框封装,并带有外露散热板以增强散热功能。
This thesis researches to address the occurrence of delamination phenomenon between the interface of molding compound and the copper leadframe die paddle during assembly process.
中文摘要本论文主要针对铜钉架在经过封装制程其本身与胶饼间所产生的脱层现象做研究。